Recommendations on Mounting

HOCKEY PUCK DEVICES

  • The surface under the semiconductor contact surface should be flat to 
    within 25.4 mm per 25.4 mm and have a surface finish of 0.03mm or 
    less and must have the heatsink surface free of grease and oxide. The
    extruded surface of the aluminum heatsink should be machined before
    final assembly.
  • In using the pre calibrated clamp it is recommended to follow strictly the
    supplier's recommendations. 
  • It is necessary that when adjusting the torque of the clamp the two surfaces of the heatsink stay parallel.
  • It is recommended to use always thermal grease between the disc type
    device surface and the heatsink surface.