The surface under the semiconductor contact surface should be flat to
within 25.4 mm per 25.4 mm and have a surface finish of 0.03mm or
less and must have the heatsink surface free of grease and oxide. The
extruded surface of the aluminum heatsink should be machined before
final assembly.
It is recommended to use always thermal grease between the device
surface and the heatsink surface.
